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Electrical nanoscale metrology in industry – Scanning microwave microscopy (SMM)
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Metrology for nanowire energy harvesting devices
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Nanomanufacturing – Key control characteristics – Part 2-xx: Single-wall carbon nanotubes – Electromagnetic compatibility: Far-field measurement
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Nanomanufacturing – Key control characteristics - Silver nanofilms – Electromagnetic compatibility: Far-field measurement
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Nanotechnologies – Nano-enabled computational spectroscopic devices
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Nanomanufacturing – Requirements for a quality management system
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Nanomanufacturing – Product specification – Part 3-7: Graphene-based heat dissipating film – Blank detail specification: Thermal management for electronic devices
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62607-8-5: Nanomanufacturing – Key Control Characteristics - Part 8-5: Nano-enabled metal-oxide interfacial devices – Oxygen distribution: SIMS
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62876-3-4:Linearity of output characteristics for metal contacted 2D semiconductor devices
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62607-6-37 – Nanomanufacturing – Key control characteristics – Part 6-37: Graphene materials – Hall resistance – Charge carrier mobility and majority
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IEC TS 62565-4-x: Nanomanufacturing – Product specifications - Part 4-x: Quantum dot materials enabled optical diffuser plates - Blank detail specification
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62607-x-y: Nanomanufacturing - Key control characteristics - Part x-y: Carbon black - Electrical resistivity
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62607-2-x: Nanomanufacturing - Key Control Characteristics Part 2-X: Carbon nanotubes – Permittivity and permeability: Coaxial method
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62607-2-x: Nanomanufacturing - Key control characteristics - Part 2-x: Multi-walled carbon nanotubes - Far-field shielding effectiveness
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IEC TS 62607-7-1: Nanomanufacturing - Key control characteristics - Part 7-1: Nano-enabled photovoltaics measurement of the electrical performance and spectral response of tandem cells
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Future IEC 62899-525-1 ED1 Printed electronics - Part 525-1: Quality Assessment - R2R printed NFC QR code label for anticounterfeiting
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Future IEC 62899-403-2 ED1 Printed electronics - Part 403-1: Printability - Requirements - for reproducibility - Basic patterns for plating
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Future IEC 62899-3XX-X ED1: Printed electronics - Part 3XX-X: Equipment - Drop size measurement by weight measurement
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